M. Engelhardt
About
M. Engelhardt has authored 30 papers that have received a total of 1.0k indexed citations.
This includes 28 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 5 papers in Mechanics of Materials. The topics of these papers are Semiconductor materials and devices (24 papers), Copper Interconnects and Reliability (19 papers) and Metal and Thin Film Mechanics (5 papers). M. Engelhardt is often cited by papers focused on Semiconductor materials and devices (24 papers), Copper Interconnects and Reliability (19 papers) and Metal and Thin Film Mechanics (5 papers) and collaborates with scholars based in Germany, Austria and France. M. Engelhardt's co-authors include G. Schindler, G. Steinlesberger, W. Steinhögl, M. Traving and E. Bertagnolli and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Applied Surface Science
In The Last Decade
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