M. Hommel
About
M. Hommel has authored 16 papers that have received a total of 525 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 12 papers in Electronic, Optical and Magnetic Materials and 7 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (12 papers), Electronic Packaging and Soldering Technologies (11 papers) and Metal and Thin Film Mechanics (7 papers). M. Hommel is often cited by papers focused on Copper Interconnects and Reliability (12 papers), Electronic Packaging and Soldering Technologies (11 papers) and Metal and Thin Film Mechanics (7 papers) and collaborates with scholars based in Germany, Austria and United States. M. Hommel's co-authors include Eduard Arzt, Oliver Kraft, W Haße, Oliver Aubel and Christian Schlünder and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Journal of materials research/Pratt's guide to venture capital sources
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by Nafiseh Shams are published in Top countries impacted by papers by Xiantao Shen Top authors papers by Ghulam Raza are co-authored with Top fields papers by R. Plačakytė are about Top countries impacted by papers by Anitha S. Kilari Top authors papers by Jeffrey R. Casterella are co-authored with Top fields papers by Dennis Marsden are about Top fields papers by M. Kıvanç Mıhçak are about