M. J. Bozack

13 papers and 408 indexed citations i.

M. J. Bozack has authored 13 papers that have received a total of 408 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 3 papers in Materials Chemistry and 2 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Silicon Carbide Semiconductor Technologies (4 papers). M. J. Bozack is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Silicon Carbide Semiconductor Technologies (4 papers) and collaborates with scholars based in United States and United Kingdom. M. J. Bozack's co-authors include John T. Yates, W. J. Choyke, L. W. Swanson, A. E. Bell and L. Muehlhoff and has published in prestigious journals such as The Journal of Chemical Physics, Journal of Applied Physics and The Journal of Physical Chemistry