M. Klingler

24 papers and 319 indexed citations i.

M. Klingler has authored 24 papers that have received a total of 319 indexed citations. This includes 13 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 7 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (5 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). M. Klingler is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Aluminum Alloys Composites Properties (5 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers) and collaborates with scholars based in Germany, France and Russia. M. Klingler's co-authors include W. Weppner, Won‐Shik Chu, Daniel Coutellier, S. Scharner and V. V. Kveder and has published in prestigious journals such as Physical Review Letters, Journal of Applied Physics and Astronomy and Astrophysics