M. Li

9 papers and 464 indexed citations i.

M. Li has authored 9 papers that have received a total of 464 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (4 papers). M. Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in Singapore, United States and China. M. Li's co-authors include Chan Choy Chum, K. N. Tu, Ke Zeng, Chi‐Man Lawrence Wu and Andriy Gusak and has published in prestigious journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical and Materials Transactions A