M. Li
About
M. Li has authored 9 papers that have received a total of 464 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 2 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (4 papers). M. Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Intermetallics and Advanced Alloy Properties (4 papers) and collaborates with scholars based in Singapore, United States and China. M. Li's co-authors include Chan Choy Chum, K. N. Tu, Ke Zeng, Chi‐Man Lawrence Wu and Andriy Gusak and has published in prestigious journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Metallurgical and Materials Transactions A
In The Last Decade
Explore authors with similar magnitude of impact
Top journals papers by B. Hinckley are published in Top journals papers by Jean‐Marie Hiltrop are published in Top fields papers by Regino Mercado–Lubo are about Top fields papers by Wanda Whitfield are about Top journals papers by Carlos García-Burgos are published in Top countries impacted by papers by L. Cortinas Top journals papers by Ernestina Fernández are published in Top journals papers by Hans J. Rumpelt are published in