M. Matsuo
About
M. Matsuo has authored 8 papers that have received a total of 104 indexed citations.
This includes 5 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Hardware and Architecture. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Embedded Systems Design Techniques (2 papers). M. Matsuo is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (3 papers) and Embedded Systems Design Techniques (2 papers) and collaborates with scholars based in Japan, Germany and United States. M. Matsuo's co-authors include Shinji Baba, H. Sato, T. Ohguro, Akitsu Shigetou and Takeshi Yoshida and has published in prestigious journals such as IEEE Transactions on Advanced Packaging, IEICE Transactions on Electronics and IEEE Transactions on Components Packaging and Manufacturing Technology Part A
In The Last Decade
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