M. McCormack
About
M. McCormack has authored 27 papers that have received a total of 6.4k indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 14 papers in Materials Chemistry and 8 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), Diamond and Carbon-based Materials Research (5 papers) and 3D IC and TSV technologies (5 papers). M. McCormack is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Diamond and Carbon-based Materials Research (5 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in United States and Germany. M. McCormack's co-authors include S. Jin, G. W. Kammlott, T. H. Tiefel, Sungho Jin and R. Ramesh and has published in prestigious journals such as Nature, Science and Applied Physics Letters
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