M. Roellig

20 papers and 121 indexed citations i.

M. Roellig has authored 20 papers that have received a total of 121 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 5 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloy Microstructure Properties (3 papers). M. Roellig is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (5 papers) and Aluminum Alloy Microstructure Properties (3 papers) and collaborates with scholars based in Germany and United States. M. Roellig's co-authors include S. Wiese, Stefan Muench, Daniel Balzani, Norbert Meyendorf and Eberhard Spoerl and has published in prestigious journals such as Ultramicroscopy, Experimental Mechanics and Microelectronics Reliability