Μ. Y. Tsai

93 papers and 2.3k indexed citations i.

Μ. Y. Tsai has authored 93 papers that have received a total of 2.3k indexed citations. This includes 52 papers in Electrical and Electronic Engineering, 38 papers in Mechanical Engineering and 35 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (28 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (25 papers). Μ. Y. Tsai is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (28 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (25 papers) and collaborates with scholars based in Taiwan, United States and Hong Kong. Μ. Y. Tsai's co-authors include J. Morton, Chen‐Yu Huang, Gary L. Farley, Fu‐Tsai Kung and D. W. Oplinger and has published in prestigious journals such as JNCI Journal of the National Cancer Institute, Journal of Applied Mechanics and Human Reproduction