Maik Wiemer

46 papers and 538 indexed citations i.

Maik Wiemer has authored 46 papers that have received a total of 538 indexed citations. This includes 38 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 10 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (20 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Maik Wiemer is often cited by papers focused on 3D IC and TSV technologies (24 papers), Electronic Packaging and Soldering Technologies (20 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers) and collaborates with scholars based in Germany, France and Japan. Maik Wiemer's co-authors include Thomas Geßner, Mario Baum, Nicolas Passilly, Sylwester Bargiel and Christophe Gorecki and has published in prestigious journals such as Industrial & Engineering Chemistry Research, IEEE Transactions on Magnetics and Sensors and Actuators A Physical