Marián Drienovský

38 papers and 290 indexed citations i.

Marián Drienovský has authored 38 papers that have received a total of 290 indexed citations. This includes 21 papers in Mechanical Engineering, 14 papers in Materials Chemistry and 12 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), Metal and Thin Film Mechanics (7 papers) and Aluminum Alloy Microstructure Properties (7 papers). Marián Drienovský is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), Metal and Thin Film Mechanics (7 papers) and Aluminum Alloy Microstructure Properties (7 papers) and collaborates with scholars based in Slovakia, Czechia and Lithuania. Marián Drienovský's co-authors include Marián Palcut, F Gömöry, Michal Skarba, Jozef Krajčovič and Jozef Janovec and has published in prestigious journals such as Materials Science and Engineering A, Journal of Alloys and Compounds and RSC Advances