Mario González

79 papers and 1.5k indexed citations i.

About

Mario González has authored 79 papers that have received a total of 1.5k indexed citations. This includes 54 papers in Electrical and Electronic Engineering, 37 papers in Biomedical Engineering and 15 papers in Mechanics of Materials. The topics of these papers are 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (21 papers) and Advanced Sensor and Energy Harvesting Materials (19 papers). Mario González is often cited by papers focused on 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (21 papers) and Advanced Sensor and Energy Harvesting Materials (19 papers) and collaborates with scholars based in Belgium, The Netherlands and United States. Mario González's co-authors include Jan Vanfleteren, Frederick Bossuyt, Ingrid De Wolf, Eric Beyne and Bart Vandevelde and has published in prestigious journals such as Applied Physics Letters, Langmuir and Journal of Materials Science

In The Last Decade

Rankless by CCL
2025