Markus Wimplinger

37 papers and 526 indexed citations i.

Markus Wimplinger has authored 37 papers that have received a total of 526 indexed citations. This includes 33 papers in Electrical and Electronic Engineering, 19 papers in Biomedical Engineering and 10 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (18 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (10 papers). Markus Wimplinger is often cited by papers focused on 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (18 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (10 papers) and collaborates with scholars based in France, Germany and Austria. Markus Wimplinger's co-authors include Viorel Drăgoi, Nasser Razek, T. Matthias, Jan Benick and Romain Cariou and has published in prestigious journals such as Journal of Applied Physics, Nature Energy and International Journal of Adhesion and Adhesives