Masaya Kawano
About
Masaya Kawano has authored 20 papers that have received a total of 113 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 4 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Masaya Kawano is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (10 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers) and collaborates with scholars based in Japan, Singapore and United States. Masaya Kawano's co-authors include Masahiro Komuro, S. Matsui, Fa Xing, Tadahiro Kuroda and Nobuaki Takahashi and has published in prestigious journals such as Biochemical and Biophysical Research Communications, IEEE Transactions on Electron Devices and Journal of Electronic Materials
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