Matthias Petzold

65 papers and 543 indexed citations i.

Matthias Petzold has authored 65 papers that have received a total of 543 indexed citations. This includes 50 papers in Electrical and Electronic Engineering, 23 papers in Biomedical Engineering and 16 papers in Mechanics of Materials. The topics of these papers are 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (26 papers) and Integrated Circuits and Semiconductor Failure Analysis (20 papers). Matthias Petzold is often cited by papers focused on 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (26 papers) and Integrated Circuits and Semiconductor Failure Analysis (20 papers) and collaborates with scholars based in Germany, United States and Finland. Matthias Petzold's co-authors include J. Bagdahn, Sebastian Brand, Frank Altmann, Manfred Reiche and Silke Christiansen and has published in prestigious journals such as Applied Physics Letters, Bone and Thin Solid Films