Megan J. Cordill
About
Megan J. Cordill has authored 171 papers that have received a total of 2.9k indexed citations.
This includes 121 papers in Mechanics of Materials, 73 papers in Electrical and Electronic Engineering and 52 papers in Materials Chemistry. The topics of these papers are Metal and Thin Film Mechanics (95 papers), Electronic Packaging and Soldering Technologies (36 papers) and Copper Interconnects and Reliability (29 papers). Megan J. Cordill is often cited by papers focused on Metal and Thin Film Mechanics (95 papers), Electronic Packaging and Soldering Technologies (36 papers) and Copper Interconnects and Reliability (29 papers) and collaborates with scholars based in Austria, Germany and United States. Megan J. Cordill's co-authors include Олександр Глушко, Barbara Pütz, Christian Mitterer, N. R. Moody and Christoph Kirchlechner and has published in prestigious journals such as Science, Advanced Materials and Applied Physics Letters
In The Last Decade
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