Meike Hauschildt
About
Meike Hauschildt has authored 28 papers that have received a total of 220 indexed citations.
This includes 27 papers in Electronic, Optical and Magnetic Materials, 26 papers in Electrical and Electronic Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (27 papers), Electronic Packaging and Soldering Technologies (22 papers) and Semiconductor materials and devices (18 papers). Meike Hauschildt is often cited by papers focused on Copper Interconnects and Reliability (27 papers), Electronic Packaging and Soldering Technologies (22 papers) and Semiconductor materials and devices (18 papers) and collaborates with scholars based in United States, Germany and France. Meike Hauschildt's co-authors include M. Gall, Martin Gall, Ehrenfried Zschech, Oliver Aubel and Paul S. Ho and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Japanese Journal of Applied Physics
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