Mei-Ling Wu

28 papers and 336 indexed citations i.

Mei-Ling Wu has authored 28 papers that have received a total of 336 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 10 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Metal Forming Simulation Techniques (5 papers). Mei-Ling Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Metal Forming Simulation Techniques (5 papers) and collaborates with scholars based in Taiwan and United States. Mei-Ling Wu's co-authors include William D. Sproul, Liang-Yu Wu, Lien-Wen Chen, Lien-Wen Chen and Vinayak P. Dravid and has published in prestigious journals such as Materials Science and Engineering A, Journal of Physics Condensed Matter and Thin Solid Films