Melody A. Verges
About
Melody A. Verges has authored 10 papers that have received a total of 381 indexed citations.
This includes 7 papers in Mechanics of Materials, 6 papers in Mechanical Engineering and 5 papers in Electrical and Electronic Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Ultrasonics and Acoustic Wave Propagation (3 papers) and 3D IC and TSV technologies (2 papers). Melody A. Verges is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Ultrasonics and Acoustic Wave Propagation (3 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in United States. Melody A. Verges's co-authors include M.C. Larson, Paul J. Schilling, Pierre F. P. Poudeu, William Keat and Paul D. Herrington and has published in prestigious journals such as Composites Science and Technology, Engineering Fracture Mechanics and International Journal of Fracture.
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