Michael D. Wedlake

6 papers and 523 indexed citations i.

About

Michael D. Wedlake has authored 6 papers that have received a total of 523 indexed citations. This includes 4 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 2 papers in Biomedical Engineering. The topics of these papers are Copper Interconnects and Reliability (3 papers), Nanofabrication and Lithography Techniques (2 papers) and 3D IC and TSV technologies (2 papers). Michael D. Wedlake is often cited by papers focused on Copper Interconnects and Reliability (3 papers), Nanofabrication and Lithography Techniques (2 papers) and 3D IC and TSV technologies (2 papers) and collaborates with scholars based in United States and Canada. Michael D. Wedlake's co-authors include Paul A. Kohl, D. M. Bhusari, Robert A. Shick, F. Klemens and Larry F. Rhodes and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, IEEE Electron Device Letters and Journal of Microelectromechanical Systems.

In The Last Decade

Fields of papers published by Michael D. Wedlake

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Michael D. Wedlake

Since Specialization
Citations
Rankless by CCL
2025