Michael Lane
About
Michael Lane has authored 45 papers that have received a total of 1.8k indexed citations.
This includes 28 papers in Electrical and Electronic Engineering, 28 papers in Electronic, Optical and Magnetic Materials and 16 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (28 papers), Electronic Packaging and Soldering Technologies (12 papers) and Metal and Thin Film Mechanics (12 papers). Michael Lane is often cited by papers focused on Copper Interconnects and Reliability (28 papers), Electronic Packaging and Soldering Technologies (12 papers) and Metal and Thin Film Mechanics (12 papers) and collaborates with scholars based in United States, France and Israel. Michael Lane's co-authors include Ganpati Ramanath, Reinhold H. Dauskardt, D. D. Gandhi, Nety Krishna and Ranganath Teki and has published in prestigious journals such as Nature, Nature Communications and Applied Physics Letters.
In The Last Decade
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