Michiya Matsushima
About
Michiya Matsushima has authored 23 papers that have received a total of 159 indexed citations.
This includes 17 papers in Mechanical Engineering, 14 papers in Electrical and Electronic Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (4 papers). Michiya Matsushima is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Advanced Welding Techniques Analysis (4 papers) and collaborates with scholars based in Japan, China and United States. Michiya Matsushima's co-authors include Satoshi Fukumoto, Shinji Fukumoto, M. Minami, Kengo Ohta and Makoto Takahashi and has published in prestigious journals such as Journal of Materials Science, IEEE Transactions on Robotics and Graefe s Archive for Clinical and Experimental Ophthalmology.
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