Min He
About
Min He has authored 41 papers that have received a total of 652 indexed citations.
This includes 20 papers in Mechanical Engineering, 14 papers in Electrical and Electronic Engineering and 9 papers in Aerospace Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (9 papers). Min He is often cited by papers focused on Electronic Packaging and Soldering Technologies (10 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloy Microstructure Properties (9 papers) and collaborates with scholars based in China, Singapore and United States. Min He's co-authors include Zhong Chen, Guo-Jun Qi, Viola L. Acoff, Zhifeng Zhang and Ping Wang and has published in prestigious journals such as Chemical Communications, Acta Materialia and Materials Science and Engineering A
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