Min Miao

54 papers and 270 indexed citations i.

Min Miao has authored 54 papers that have received a total of 270 indexed citations. This includes 39 papers in Electrical and Electronic Engineering, 16 papers in Materials Chemistry and 8 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). Min Miao is often cited by papers focused on 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers) and collaborates with scholars based in China, Singapore and Egypt. Min Miao's co-authors include Yufeng Jin, Bingwei Luo, Fei Su and Lili Cao and has published in prestigious journals such as ACS Applied Materials & Interfaces, Nanoscale and International Journal of Heat and Mass Transfer