Minghui Lin

13 papers and 341 indexed citations i.

Minghui Lin has authored 13 papers that have received a total of 341 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 7 papers in Mechanics of Materials and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), Copper Interconnects and Reliability (6 papers) and Metal and Thin Film Mechanics (5 papers). Minghui Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), Copper Interconnects and Reliability (6 papers) and Metal and Thin Film Mechanics (5 papers) and collaborates with scholars based in United States, China and Taiwan. Minghui Lin's co-authors include Cemal Basaran, Hanjun Gao, Hua Ye, Yidu Zhang and Qiong Wu and has published in prestigious journals such as International Journal of Solids and Structures, QJM and The International Journal of Advanced Manufacturing Technology