Mingliang Huang

111 papers and 1.9k indexed citations i.

Mingliang Huang has authored 111 papers that have received a total of 1.9k indexed citations. This includes 101 papers in Electrical and Electronic Engineering, 59 papers in Mechanical Engineering and 21 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (59 papers) and Intermetallics and Advanced Alloy Properties (28 papers). Mingliang Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (59 papers) and Intermetallics and Advanced Alloy Properties (28 papers) and collaborates with scholars based in China, Hong Kong and United States. Mingliang Huang's co-authors include Ning Zhao, Haitao Ma, Yi Zhong and Chi‐Man Lawrence Wu and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.