Miyuki Uomoto

31 papers and 338 indexed citations i.

Miyuki Uomoto has authored 31 papers that have received a total of 338 indexed citations. This includes 28 papers in Electrical and Electronic Engineering, 9 papers in Atomic and Molecular Physics, and Optics and 6 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (15 papers) and Copper Interconnects and Reliability (6 papers). Miyuki Uomoto is often cited by papers focused on 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (15 papers) and Copper Interconnects and Reliability (6 papers) and collaborates with scholars based in Japan, United States and China. Miyuki Uomoto's co-authors include T. Shimatsu, Takashi Mukai, M. Ichikawa, Ichi Tanaka and Hideaki Matsuzaki and has published in prestigious journals such as Antimicrobial Agents and Chemotherapy, Applied Surface Science and Japanese Journal of Applied Physics