M.J. Rizvi

26 papers and 722 indexed citations i.

M.J. Rizvi has authored 26 papers that have received a total of 722 indexed citations. This includes 17 papers in Mechanical Engineering, 13 papers in Electrical and Electronic Engineering and 11 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Mechanical Behavior of Composites (7 papers). M.J. Rizvi is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Mechanical Behavior of Composites (7 papers) and collaborates with scholars based in United Kingdom, Hong Kong and Iraq. M.J. Rizvi's co-authors include C. Bailey, Hua Lu, Stephen Grove, Mobinul Islam and Y.C. Chan and has published in prestigious journals such as Journal of Cleaner Production, Journal of Alloys and Compounds and Thin Solid Films