M.O. Alam

44 papers and 1.2k indexed citations i.

M.O. Alam has authored 44 papers that have received a total of 1.2k indexed citations. This includes 41 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 6 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (29 papers) and Advanced Welding Techniques Analysis (12 papers). M.O. Alam is often cited by papers focused on Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (29 papers) and Advanced Welding Techniques Analysis (12 papers) and collaborates with scholars based in Hong Kong, United Kingdom and United States. M.O. Alam's co-authors include Y.C. Chan, Bin Wu, Y.C. Chan, C. Bailey and Hongmei Zhong and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials