Mohd Izrul Izwan Ramli

53 papers and 322 indexed citations i.

Mohd Izrul Izwan Ramli has authored 53 papers that have received a total of 322 indexed citations. This includes 49 papers in Electrical and Electronic Engineering, 40 papers in Mechanical Engineering and 6 papers in Ceramics and Composites. The topics of these papers are Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (30 papers) and Aluminum Alloys Composites Properties (21 papers). Mohd Izrul Izwan Ramli is often cited by papers focused on Electronic Packaging and Soldering Technologies (49 papers), 3D IC and TSV technologies (30 papers) and Aluminum Alloys Composites Properties (21 papers) and collaborates with scholars based in Malaysia, Australia and Japan. Mohd Izrul Izwan Ramli's co-authors include Mohd Arif Anuar Mohd Salleh, Kazuhiro Nogita, Hideyuki Yasuda, Jitrin Chaiprapa and Mohd Nazree Derman and has published in prestigious journals such as Journal of Alloys and Compounds, Materials & Design and Materials.