Mulan Li
About
Mulan Li has authored 23 papers that have received a total of 430 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 4 papers in Molecular Biology. The topics of these papers are Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (10 papers) and 3D IC and TSV technologies (5 papers). Mulan Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (10 papers) and 3D IC and TSV technologies (5 papers) and collaborates with scholars based in China, South Korea and Puerto Rico. Mulan Li's co-authors include Sujuan Zhong, Lili Gao, Woo Kyung Moon and Yulin Feng and has published in prestigious journals such as Radiology, Molecules and Journal of Ethnopharmacology
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