Navas Khan

18 papers and 243 indexed citations i.

Navas Khan has authored 18 papers that have received a total of 243 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (15 papers) and Metal Forming Simulation Techniques (3 papers). Navas Khan is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (15 papers) and Metal Forming Simulation Techniques (3 papers) and collaborates with scholars based in Singapore, Malaysia and Taiwan. Navas Khan's co-authors include V. Kripesh, D. Pinjala, John H. Lau, K.C. Toh and Seung Wook Yoon and has published in prestigious journals such as Advanced Powder Technology, Microelectronics Reliability and Heat Transfer Engineering