Nobumichi Tamura
About
Nobumichi Tamura has authored 317 papers that have received a total of 9.5k indexed citations.
This includes 130 papers in Materials Chemistry, 97 papers in Electrical and Electronic Engineering and 73 papers in Mechanics of Materials. The topics of these papers are Metal and Thin Film Mechanics (49 papers), Copper Interconnects and Reliability (37 papers) and Electronic Packaging and Soldering Technologies (37 papers). Nobumichi Tamura is often cited by papers focused on Metal and Thin Film Mechanics (49 papers), Copper Interconnects and Reliability (37 papers) and Electronic Packaging and Soldering Technologies (37 papers) and collaborates with scholars based in United States, China and France. Nobumichi Tamura's co-authors include Martin Kunz, Arief Suriadi Budiman, J. R. Patel, Richard Celestre and H. A. Padmore and has published in prestigious journals such as Nature, Science and Proceedings of the National Academy of Sciences
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