O. Ehrmann
About
O. Ehrmann has authored 45 papers that have received a total of 292 indexed citations.
This includes 38 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (17 papers), Advanced MEMS and NEMS Technologies (15 papers) and Electronic Packaging and Soldering Technologies (14 papers). O. Ehrmann is often cited by papers focused on 3D IC and TSV technologies (17 papers), Advanced MEMS and NEMS Technologies (15 papers) and Electronic Packaging and Soldering Technologies (14 papers) and collaborates with scholars based in Germany, China and South Korea. O. Ehrmann's co-authors include H. Reichl, Michael J. Topper, Klaus‐Dieter Lang, T. Fritzsch and Ha-Duong Ngo and has published in prestigious journals such as Applied Physics Letters, Sensors and Review of Scientific Instruments
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