Olaf Wittler
About
Olaf Wittler has authored 29 papers that have received a total of 149 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 10 papers in Mechanics of Materials and 9 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Material Properties and Processing (4 papers). Olaf Wittler is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (8 papers) and Material Properties and Processing (4 papers) and collaborates with scholars based in Germany, Poland and United Kingdom. Olaf Wittler's co-authors include B. Michel, B. Wunderle, Martin Schneider‐Ramelow, H. Walter and K.-D. Lang and has published in prestigious journals such as IEEE Journal of Quantum Electronics, Microelectronics Reliability and Microsystem Technologies
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