O.S. Nakagawa
About
O.S. Nakagawa has authored 17 papers that have received a total of 209 indexed citations.
This includes 16 papers in Electrical and Electronic Engineering, 4 papers in Atomic and Molecular Physics, and Optics and 2 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (4 papers). O.S. Nakagawa is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in United States, Japan and Germany. O.S. Nakagawa's co-authors include B.E. Stine, Dennis O. Ouma, Duane S. Boning, S. Ashok and Soo‐Young Oh and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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