P. Flaitz

23 papers and 472 indexed citations i.

P. Flaitz has authored 23 papers that have received a total of 472 indexed citations. This includes 16 papers in Electrical and Electronic Engineering, 11 papers in Electronic, Optical and Magnetic Materials and 6 papers in Biomedical Engineering. The topics of these papers are Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (10 papers) and Electronic Packaging and Soldering Technologies (5 papers). P. Flaitz is often cited by papers focused on Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (10 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in United States, Switzerland and Japan. P. Flaitz's co-authors include Paul Ronsheim, Keith Thompson, D. Edelstein, C.-C. Yang and M. Sankarapandian and has published in prestigious journals such as Science, Applied Physics Letters and Journal of Applied Physics