P. M. Hall

45 papers and 1.3k indexed citations i.

P. M. Hall has authored 45 papers that have received a total of 1.3k indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 11 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (15 papers), Copper Interconnects and Reliability (11 papers) and 3D IC and TSV technologies (8 papers). P. M. Hall is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Copper Interconnects and Reliability (11 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in United States, Canada and United Kingdom. P. M. Hall's co-authors include J.M. Morabito, F. H. Spedding, T. D. Dudderar, S. Legvold and Jan G. Hengstler and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society