Patrick Leduc

11 papers and 107 indexed citations i.

Patrick Leduc has authored 11 papers that have received a total of 107 indexed citations. This includes 5 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (3 papers). Patrick Leduc is often cited by papers focused on 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (3 papers) and collaborates with scholars based in France, Switzerland and United States. Patrick Leduc's co-authors include G. Passemard, N. Sillon, S. Maı̂trejean, David Henry and L. Di Cioccio and has published in prestigious journals such as Nature Materials, Proceedings of the IEEE and Journal of materials research/Pratt's guide to venture capital sources