Patrick McCluskey
About
Patrick McCluskey has authored 52 papers that have received a total of 1.1k indexed citations.
This includes 38 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 11 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (22 papers), Silicon Carbide Semiconductor Technologies (10 papers) and 3D IC and TSV technologies (8 papers). Patrick McCluskey is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), Silicon Carbide Semiconductor Technologies (10 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in United States, Japan and Sweden. Patrick McCluskey's co-authors include Avram Bar‐Cohen, Michael Pecht, Michael Ohadi, Martin L. Dunn and R. Sundararajan and has published in prestigious journals such as Journal of Power Sources, International Journal of Heat and Mass Transfer and IEEE Transactions on Power Electronics
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