Paul Lauro
About
Paul Lauro has authored 21 papers that have received a total of 935 indexed citations.
This includes 17 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Metal and Thin Film Mechanics (3 papers). Paul Lauro is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (7 papers) and Metal and Thin Film Mechanics (3 papers) and collaborates with scholars based in United States, South Korea and China. Paul Lauro's co-authors include Da‐Yuan Shih, Keith Fogel, J. A. Ott, Stephen W. Bedell and D. K. Sadana and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Advanced Energy Materials
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