Paul S. Ho

327 papers and 7.3k indexed citations i.

Paul S. Ho has authored 327 papers that have received a total of 7.3k indexed citations. This includes 210 papers in Electrical and Electronic Engineering, 162 papers in Electronic, Optical and Magnetic Materials and 85 papers in Mechanics of Materials. The topics of these papers are Copper Interconnects and Reliability (159 papers), Electronic Packaging and Soldering Technologies (122 papers) and Semiconductor materials and devices (90 papers). Paul S. Ho is often cited by papers focused on Copper Interconnects and Reliability (159 papers), Electronic Packaging and Soldering Technologies (122 papers) and Semiconductor materials and devices (90 papers) and collaborates with scholars based in United States, Germany and Japan. Paul S. Ho's co-authors include Rui Huang, Jay Im, Jie-Hua Zhao, Ehrenfried Zschech and Tengfei Jiang and has published in prestigious journals such as Science, Physical Review Letters and Applied Physics Letters