Pay Jun Liew
About
Pay Jun Liew has authored 24 papers that have received a total of 491 indexed citations.
This includes 24 papers in Mechanical Engineering, 18 papers in Electrical and Electronic Engineering and 14 papers in Biomedical Engineering. The topics of these papers are Advanced Machining and Optimization Techniques (18 papers), Advanced machining processes and optimization (17 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (14 papers). Pay Jun Liew is often cited by papers focused on Advanced Machining and Optimization Techniques (18 papers), Advanced machining processes and optimization (17 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (14 papers) and collaborates with scholars based in Malaysia, Japan and China. Pay Jun Liew's co-authors include Jiwang Yan, Tsunemoto Kuriyagawa, Keita Shimada, Tianfeng Zhou and Nor Azwadi Che Sidik and has published in prestigious journals such as International Journal of Heat and Mass Transfer, Applied Surface Science and Journal of Materials Processing Technology
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