Peng Ding
About
Peng Ding has authored 27 papers that have received a total of 735 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. The topics of these papers are Copper Interconnects and Reliability (10 papers), Semiconductor materials and devices (9 papers) and Electronic Packaging and Soldering Technologies (4 papers). Peng Ding is often cited by papers focused on Copper Interconnects and Reliability (10 papers), Semiconductor materials and devices (9 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in United States, China and Sweden. Peng Ding's co-authors include W. A. Lanford, S. Hymes, Sheng Qin, S. P. Murarka and Ke Xing and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Industrial & Engineering Chemistry Research
In The Last Decade
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