Per‐Erik Tegehall
About
Per‐Erik Tegehall has authored 16 papers that have received a total of 229 indexed citations.
This includes 8 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 6 papers in Industrial and Manufacturing Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Chemical Synthesis and Characterization (5 papers). Per‐Erik Tegehall is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Chemical Synthesis and Characterization (5 papers) and collaborates with scholars based in Sweden, China and Finland. Per‐Erik Tegehall's co-authors include Dag Andersson, Johan Liu, A. M. Mulichak, Magnus Erickson and Svante Johansson and has published in prestigious journals such as Corrosion Science, Acta chemica Scandinavica/Acta chemica Scandinavica. B, Organic chemistry and biochemistry/Acta chemica Scandinavica. A, Physical and inorganic chemistry/Acta chemica Scandinavica. Series B. Organic chemistry and biochemistry/Acta chemica Scandinavica. Series A, Physical and inorganic chemistry and Surface and Interface Analysis
In The Last Decade
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