Pilin Liu
About
Pilin Liu has authored 7 papers that have received a total of 171 indexed citations.
This includes 6 papers in Electrical and Electronic Engineering, 2 papers in Mechanics of Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Fatigue and fracture mechanics (2 papers). Pilin Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Fatigue and fracture mechanics (2 papers) and collaborates with scholars based in United States and Taiwan. Pilin Liu's co-authors include Jimin Yao, Charles Zhang, Brian W. Grimsley, Deepak Goyal and Arun Raman and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Scripta Materialia
In The Last Decade
Explore authors with similar magnitude of impact
Top countries impacted by papers by Bart Vanmontfort Top fields papers by S. Schubert are about Top authors papers by Pavle Prentašić are co-authored with Top fields papers by Lisa L. Ellis are about Top authors papers by Kenta Katayama are co-authored with Top authors papers by William Travis Howard are co-authored with Top journals papers by Marco Rensi are published in Top journals papers by EA Envuladu are published in