Pilin Liu

7 papers and 171 indexed citations i.

Pilin Liu has authored 7 papers that have received a total of 171 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 2 papers in Mechanics of Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Fatigue and fracture mechanics (2 papers). Pilin Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (4 papers) and Fatigue and fracture mechanics (2 papers) and collaborates with scholars based in United States and Taiwan. Pilin Liu's co-authors include Jimin Yao, Charles Zhang, Brian W. Grimsley, Deepak Goyal and Arun Raman and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Scripta Materialia