Ping Wu

74 papers and 1.3k indexed citations i.

Ping Wu has authored 74 papers that have received a total of 1.3k indexed citations. This includes 47 papers in Electrical and Electronic Engineering, 37 papers in Mechanical Engineering and 25 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (34 papers), Intermetallics and Advanced Alloy Properties (22 papers) and 3D IC and TSV technologies (17 papers). Ping Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (34 papers), Intermetallics and Advanced Alloy Properties (22 papers) and 3D IC and TSV technologies (17 papers) and collaborates with scholars based in China, United States and Singapore. Ping Wu's co-authors include Wei Zhou, H.L. Bai, E. Y. Jiang and Yinghua Liang and has published in prestigious journals such as Journal of Applied Physics, The Journal of Physical Chemistry C and Chemical Physics Letters