Ping‐Feng Yang
About
Ping‐Feng Yang has authored 24 papers that have received a total of 680 indexed citations.
This includes 12 papers in Electrical and Electronic Engineering, 11 papers in Mechanics of Materials and 10 papers in Materials Chemistry. The topics of these papers are Metal and Thin Film Mechanics (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Diamond and Carbon-based Materials Research (5 papers). Ping‐Feng Yang is often cited by papers focused on Metal and Thin Film Mechanics (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Diamond and Carbon-based Materials Research (5 papers) and collaborates with scholars based in Taiwan and China. Ping‐Feng Yang's co-authors include Yi‐Shao Lai, Sheng‐Rui Jian, Rongsheng Chen, Jiunn Chen and Hua‐Chiang Wen and has published in prestigious journals such as Materials Science and Engineering A, Energy and Applied Catalysis A General
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